Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ0506NS
MA001282946
PG-TSDSON-8-25
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.182
0.004
0.015
0.291
11.804
0.014
0.037
1.884
16.369
0.395
0.020
0.008
0.006
0.307
0.001
0.004
0.073
2.959
Average
Mass
[%]
0.53
0.01
0.04
0.85
34.34
0.04
0.11
5.48
47.63
1.15
0.06
0.02
0.02
0.89
0.00
0.01
0.21
8.61
28. April 2015
34.37 mg
Sum
[%]
0.53
Average
Mass
[ppm]
5294
106
423
8458
35.24
0.04
343422
410
1064
54806
53.22
1.15
0.06
476226
11500
591
234
187
0.93
8935
27
106
2120
8.83
86091
88344
1000000
9356
532096
11500
591
352409
410
Sum
[ppm]
5294
wire
encapsulation
leadfinish
plating
solder
heat sink CLIP
*deviation
< 10%
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com