Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTF3050TE
MA001263764
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.424
0.205
0.061
204.243
1.228
1.413
24.720
115.126
5.072
0.076
0.000
0.038
0.030
1.448
Average
Mass
[%]
0.40
0.06
0.02
57.51
0.35
0.40
6.96
32.42
1.43
0.02
0.00
0.01
0.01
0.41
27. March 2015
355.09 mg
Sum
[%]
0.40
Average
Mass
[ppm]
4011
576
173
57.59
0.35
575195
3458
3978
69618
39.78
1.43
324219
14285
215
0.02
1
107
85
0.43
4079
4271
1000000
216
397815
14285
575944
3458
Sum
[ppm]
4011
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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