Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
bumps
BGA 825L6S E6327
MA001056000
PG-TSLP-6-3
Material Group
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
non noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
silver
tin
copper
nickel
carbon black
epoxy resin
silicondioxide
gold
silver
copper
titanium
tungsten
CAS#
if applicable
7440-21-3
7440-22-4
7440-31-5
7440-50-8
7440-02-0
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-50-8
7440-32-6
7440-33-7
Issued
Weight*
Weight
[mg]
0.214
0.000
0.001
0.006
0.110
0.002
0.067
0.394
0.011
0.021
0.000
0.000
0.000
Average
Mass
[%]
25.94
0.00
0.07
0.73
13.34
0.28
8.13
47.69
1.28
2.53
0.01
0.00
0.00
30. April 2015
0.83 mg
Sum
[%]
25.94
Average
Mass
[ppm]
259441
17
739
0.80
13.34
7332
133407
2804
81323
56.10
1.28
2.53
476721
12841
25273
67
23
0.01
12
102
1000000
560848
12841
25273
8088
133407
Sum
[ppm]
259441
leadframe
encapsulation
leadfinish
plating
ubm
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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