Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE1HS01G
MA001051864
PG-DSO-8-41
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.020
0.008
0.034
0.673
27.330
0.116
0.143
4.613
42.800
0.814
0.090
0.302
1.209
Average
Mass
[%]
3.72
0.01
0.04
0.83
33.68
0.14
0.18
5.68
52.75
1.00
0.11
0.37
1.49
27. May 2015
81.15 mg
Sum
[%]
3.72
Average
Mass
[ppm]
37218
104
415
8294
34.56
0.14
336780
1432
1758
56843
58.61
1.00
0.11
527408
10029
1104
3723
1.86
14892
18615
1000000
586009
10029
1104
345593
1432
Sum
[ppm]
37218
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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