Power Management Circuit, Fixed, +4.55VV, CMOS, PDSO8,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP8,.25 |
Reach Compliance Code | unknown |
可调阈值 | NO |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3/5 V |
认证状态 | Not Qualified |
最大供电电流 (Isup) | 0.015 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
阈值电压标称 | +4.55V |
PCF1252-1T | PCF1252-0P | PCF1252-1P | PCF1252-4P | PCF1252-7T | PCF1252-8P | |
---|---|---|---|---|---|---|
描述 | Power Management Circuit, Fixed, +4.55VV, CMOS, PDSO8, | Power Management Circuit, Fixed, +4.75VV, CMOS, PDIP8, | Power Management Circuit, Fixed, +4.55VV, CMOS, PDIP8, | Power Management Circuit, Fixed, +3.75VV, CMOS, PDIP8, | Power Management Circuit, Fixed, +3VV, CMOS, PDSO8, | Power Management Circuit, Fixed, +2.75VV, CMOS, PDIP8, |
是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
可调阈值 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | e4 | e4 | e4 | e0 | e4 | e0 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | DIP | SOP | DIP |
封装等效代码 | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电流 (Isup) | 0.015 mA | 0.01 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
表面贴装 | YES | NO | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
阈值电压标称 | +4.55V | +4.75V | +4.55V | +3.75V | +3V | +2.75V |
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