Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC120N03MS G
MA001321272
PG-TDSON-8-14
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.614
0.010
0.039
0.778
31.590
0.054
0.242
7.504
40.665
1.243
0.037
0.024
0.020
0.932
0.005
0.021
0.428
17.360
0.017
0.005
16.898
Average
Mass
[%]
0.52
0.01
0.03
0.66
26.66
0.05
0.20
6.33
34.33
1.05
0.03
0.02
0.02
0.79
0.00
0.02
0.36
14.65
0.01
0.00
14.26
5. February 2015
118.49 mg
Sum
[%]
0.52
Average
Mass
[ppm]
5180
82
328
6566
27.36
0.05
266615
455
2043
63330
40.86
1.05
0.03
343208
10487
316
206
165
0.83
7865
45
180
3608
15.03
146515
143
43
14.27
142620
142806
1000000
150348
8236
408581
10487
316
273591
455
Sum
[ppm]
5180
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
non noble metal
inorganic material
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
FPGA/CPLD
京公网安备 11010802033920号
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