Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC060N10NS3 G
MA000473366
PG-TDSON-8-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
silver
iron
phosphorus
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7440-22-4
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
4.423
0.038
0.011
37.762
0.065
0.080
5.660
34.121
1.452
0.166
0.087
0.070
3.327
1.289
0.011
0.003
11.320
0.022
0.007
22.292
Average
Mass
[%]
3.62
0.03
0.01
30.89
0.05
0.07
4.63
27.92
1.19
0.14
0.07
0.06
2.72
1.06
0.01
0.00
9.26
0.02
0.01
18.24
28. November 2014
122.21 mg
Sum
[%]
3.62
Average
Mass
[ppm]
36194
309
93
30.93
0.05
309000
533
652
46317
32.62
1.19
0.14
279210
11879
1354
713
570
2.85
1.06
27224
10552
93
28
9.27
92631
183
55
18.27
182410
182648
1000000
92752
28507
10552
326179
11879
1354
309402
533
Sum
[ppm]
36194
wire
encapsulation
leadfinish
plating
solder
CLIP plating
heatspreader
heat sink CLIP
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
