Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC030N04NS G
MA001272214
PG-TDSON-8-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
silver
iron
phosphorus
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7440-22-4
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
2.391
0.038
0.011
37.762
0.042
0.084
5.935
35.777
1.452
0.166
0.057
0.046
2.173
1.289
0.011
0.003
11.320
0.022
0.007
22.292
Average
Mass
[%]
1.98
0.03
0.01
31.23
0.03
0.07
4.91
29.60
1.20
0.14
0.05
0.04
1.80
1.07
0.01
0.00
9.36
0.02
0.01
18.44
5. December 2014
120.88 mg
Sum
[%]
1.98
Average
Mass
[ppm]
19782
313
94
31.27
0.03
312398
344
692
49100
34.58
1.20
0.14
295980
12009
1369
471
376
1.89
1.07
17977
10668
94
28
9.37
93649
185
55
18.47
184416
184656
1000000
93771
18824
10668
345772
12009
1369
312805
344
Sum
[ppm]
19782
wire
encapsulation
leadfinish
plating
solder
CLIP plating
heatspreader
heat sink CLIP
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
FPGA/CPLD
京公网安备 11010802033920号
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