Buffer, CMOS, CDIP14,
参数名称 | 属性值 |
厂商名称 | Aeroflex |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T14 |
逻辑集成电路类型 | BUFFER |
最大I(ol) | 0.0001 A |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 11 ns |
施密特触发器 | NO |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
UT54ACS34-PCX | UT54ACS34-PCA | UT54ACS34-PCC | UT54ACTS34-UCX | UT54ACS34-UCX | UT54ACTS34-PCX | UT54ACTS34-PCC | UT54ACS34-UCC | |
---|---|---|---|---|---|---|---|---|
描述 | Buffer, CMOS, CDIP14, | Buffer, CMOS, CDIP14, | Buffer, CMOS, CDIP14, | Buffer, CMOS, CDFP14, | Buffer, CMOS, CDFP14, | Buffer, CMOS, CDIP14, | Buffer, CMOS, CDIP14, | Buffer, CMOS, CDFP14, |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 |
逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
最大I(ol) | 0.0001 A | 0.0001 A | 0.0001 A | 0.008 A | 0.0001 A | 0.008 A | 0.008 A | 0.0001 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DFP | DFP | DIP | DIP | DFP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Aeroflex | - | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |
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