Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
1EDI10I12MF
MA001245992
PG-DSO-8-51
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.235
0.008
0.033
0.660
26.789
0.228
0.146
4.725
43.842
0.814
0.095
0.180
0.637
Average
Mass
[%]
2.78
0.01
0.04
0.82
33.32
0.28
0.18
5.88
54.55
1.01
0.12
0.22
0.79
19. February 2015
80.39 mg
Sum
[%]
2.78
Average
Mass
[ppm]
27802
103
410
8207
34.19
0.28
333233
2832
1818
58777
60.61
1.01
0.12
545354
10123
1185
2234
1.01
7922
10156
1000000
605949
10123
1185
341953
2832
Sum
[ppm]
27802
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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