Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC1302-T038X0016 AA
MA001206392
PG-TSSOP-38-9
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.097
0.015
0.060
1.199
48.679
0.003
0.308
0.192
7.494
56.362
2.173
0.337
0.102
0.307
Average
Mass
[%]
0.93
0.01
0.05
1.01
41.14
0.00
0.26
0.16
6.33
47.64
1.84
0.28
0.09
0.26
31. October 2014
118.33 mg
Sum
[%]
0.93
Average
Mass
[ppm]
9274
127
507
10132
42.21
411393
26
0.26
2599
1624
63328
54.13
1.84
0.28
476315
18361
2850
866
0.35
2598
3464
1000000
541267
18361
2850
2625
422159
Sum
[ppm]
9274
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
DSP 与 ARM 处理器
京公网安备 11010802033920号
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