bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
These optocouplers are suitable
for high speed logic interfacing,
input/output buffering, as line
receivers in environments that
conventional line receivers
cannot tolerate and are
recommended for use in
extremely high ground or induced
noise environments.
These optocouplers are available
in an 8-pin DIP and industry
standard SO-8 package. The part
numbers are as follows:
8-pin DIP
HCPL-260L
HCPL-263L
SO-8 Package
HCPL-060L
HCPL-063L
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-260L #XXXX
060 = IEC/EN/DIN EN 60747-5-2
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact Agilent sales representative or
authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
Schematic
HCPL-260L/060L
I
CC
8
I
O
6
V
CC
1
I
F1
HCPL-263L/063L
I
CC
8
I
O1
7
V
CC
V
O1
I
F
2+
V
O
+
V
F1
V
F
–
3
SHIELD
I
E
5
7
V
E
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 5).
GND
–
2
SHIELD
3
–
V
F2
+
4
SHIELD
5
GND
I
F2
I
O2
6
V
O2
2
Package Outline Drawings
8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
Regulatory Information
The HCPL-260L/060L/263L/063L
have been approved by the
following organizations:
UL
TEMPERATURE (°C)
200
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
Approval under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
PB-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
t
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
4
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil)
Value
7.1
7.4
0.08
SO-8
Value
4.9
4.8
0.08
Parameter
Minimum External Air
Gap (External Clearance)
Minimum External Tracking
(External Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Symbol
L (101)
L (102)
Units
mm
mm
mm
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
CTI
200
200
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
150 V rms
for rated mains voltage
≤
300 V rms
for rated mains voltage
≤
600 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test
with t
m
= 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
PDIP Option 060
SO-8 Option 60
I-IV
I-III
I-II
55/85/21
2
566
1063
Units
V
IORM
V
PR
I-IV
I-III
55/85/21
2
630
1181
V
peak
V
peak
V
PR
V
IOTM
945
6000
849
4000
V
peak
V
peak
T
S
I
S,INPUT
P
S,OUTPUT
R
S
175
230
600
≥
10
9
150
150
600
≥
10
9
˚C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed
description.
Note:
Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.