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KM416C4104BS-6

产品描述EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50
产品类别存储    存储   
文件大小804KB,共36页
制造商SAMSUNG(三星)
官网地址http://www.samsung.com/Products/Semiconductor/
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KM416C4104BS-6概述

EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50

KM416C4104BS-6规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称SAMSUNG(三星)
零件包装代码TSOP2
包装说明TSOP2, TSOP50,.46,32
针数50
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FAST PAGE WITH EDO
最长访问时间60 ns
其他特性RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型COMMON
JESD-30 代码R-PDSO-G50
JESD-609代码e0
长度20.95 mm
内存密度67108864 bit
内存集成电路类型EDO DRAM
内存宽度16
功能数量1
端口数量1
端子数量50
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSOP50,.46,32
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
电源5 V
认证状态Not Qualified
刷新周期4096
座面最大高度1.2 mm
自我刷新NO
最大待机电流0.001 A
最大压摆率0.11 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
宽度10.16 mm

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KM416C4004B, KM416C4104B
CMOS DRAM
4M x 16bit CMOS Dynamic RAM with Extended Data Out
DESCRIPTION
This is a family of 4,194,304 x 16 bit Extended Data Out Mode CMOS DRAMs. Extended Data Out Mode offers high speed random
access of memory cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-45, -5 or -6) are optional features of this
family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. This 4Mx16 EDO Mode DRAM
family is fabricated using Samsung′s advanced CMOS process to realize high band-width, low power consumption and high reliability.
FEATURES
• Part Identification
- KM416C4004B(5.0V, 8K Ref.)
- KM416C4104B(5.0V, 4K Ref.)
Active Power Dissipation
Unit : mW
Speed
-45
-5
-6
8K
550
495
440
4K
715
660
605
• Extended Data Out Mode operation
• 2 CAS Byte/Word Read/Write operation
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
• Fast parallel test mode capability
• TTL(5.0V) compatible inputs and outputs
• Early Write or output enable controlled write
• JEDEC Standard pinout
• Available in Plastic TSOP(II) package
• +5.0V±10% power supply
Refresh Cycles
Part
NO.
KM416C4004B*
KM416C4104B
Refresh
cycle
8K
4K
Refresh time
Normal
64ms
RAS
UCAS
LCAS
W
Control
Clocks
Vcc
Vss
Lower
Data in
Buffer
Sense Amps & I/O
Lower
Data out
Buffer
Upper
Data in
Buffer
Upper
Data out
Buffer
FUNCTIONAL BLOCK DIAGRAM
VBB Generator
* Access mode & RAS only refresh mode
: 8K cycle/64ms
CAS-before-RAS & Hidden refresh mode
: 4K cycle/64ms
Performance Range
Speed
-45
-5
-6
Refresh Timer
Refresh Control
Refresh Counter
Row Decoder
DQ0
to
DQ7
Memory Array
4,194,304 x 16
Cells
OE
t
RAC
45ns
50ns
60ns
t
CAC
12ns
13ns
15ns
t
RC
74ns
84ns
104ns
t
HPC
17ns
20ns
25ns
A0~A12
(A0~A11)*1
A0~A8
(A0~A9)*1
Row Address Buffer
Col. Address Buffer
Column Decoder
DQ8
to
DQ15
Note) *1 : 4K Refresh
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to
change products and specifications without notice.

KM416C4104BS-6相似产品对比

KM416C4104BS-6 KM416C4004BS-6 KM416C4004BS-45 KM416C4004BS-5 KM416C4104BS-5 KM416C4104BS-45
描述 EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 EDO DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 EDO DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 EDO DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 EDO DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50
零件包装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
包装说明 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32
针数 50 50 50 50 50 50
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
最长访问时间 60 ns 60 ns 45 ns 50 ns 50 ns 45 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50
长度 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm
内存密度 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
内存宽度 16 16 16 16 16 16
功能数量 1 1 1 1 1 1
端口数量 1 1 1 1 1 1
端子数量 50 50 50 50 50 50
字数 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
是否Rohs认证 不符合 不符合 - 不符合 不符合 不符合
I/O 类型 COMMON COMMON - COMMON COMMON COMMON
JESD-609代码 e0 e0 - e0 e0 e0
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE
封装等效代码 TSOP50,.46,32 TSOP50,.46,32 - TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32
电源 5 V 5 V - 5 V 5 V 5 V
刷新周期 4096 8192 - 8192 4096 4096
自我刷新 NO NO - NO NO NO
最大待机电流 0.001 A 0.001 A - 0.001 A 0.001 A 0.001 A
最大压摆率 0.11 mA 0.11 mA - 0.12 mA 0.12 mA 0.13 mA
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)

 
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