Bond-Ply
®
LMS 500P
April 2012
PRODUCT DESCRIPTION
Thermally Conductive, Polyimide Reinforced,
Laminate Material-Silicone
FEATURES AND BENEFITS
• Polyimide film provides high
dielectric strength
• Intended for secondary and primary
voltage power applications
• Reliable lap shear strength at
temperature extremes
• Quick cure rate
• Excellent CTE and shock/vibe absorption
PROPERTY
Color
TYPICAL PROPERTIES OF BOND-PLY LMS 500P
IMPERIAL VALUE
Orange
Polyimide Film
0.008
200
METRIC VALUE
Orange
Polyimide Film
0.203
1.4
VALUE
6000
V-O
0.7
25
3.5
TEST METHOD
Visual
—
ASTM D374
ASTM D1002
Reinforcement Carrier
Thickness (inch) / (mm)
ADHESION
Lap Shear @ RT (psi) / (MPa) (1)
ELECTRICAL
Dielectric Breakdown Voltage (Vac) (2)
Flame Rating
TEST METHOD
ASTM D149
U.L.94
ASTM D5470
75
2.8
THERMAL
Bulk Thermal Conductivity of Resin (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
Lamination Pressure (psi)
TO-220 Thermal Performance (°C/W) (3)
1) Laminates at 75psi, cured at 160°C for 6 minutes. Lap Shear tested at 25°C.
2) The ASTM D149 test method was completed on cured Bond-Ply LMS 500P material. No pressure was applied to the product
during the cure cycle. Actual application dielectric performance will vary with primary dependence on consistent material handling of
Bond-Ply LMS 500P in the pre-cured or "green" state and applied pressure and dwell time during the lamination process.
3) TO-220 Thermal Performance testing, per The Bergquist RD2010 specification for Laminates, was completed on pre-laminated TO-
220 assemblies. Lamination was completed at the pressure levels referenced above. Actual pressure during performance testing
was limited to the inherent weight distribution of the TO-220 component. No additional pressure was applied.
TYPICAL APPLICATIONS INCLUDE
• Discrete semi-conductor packages bonded to heat spreader or heat sink
Bond-Ply
®
LMS 500P is a thermally
conductive laminate with a polyimide film
substrate.The product consists of a high
performance thermally conductive low
modulus silicone compound coated both
sides of a polyimide film, and double
lined with protective films.The low modulus
silicone design effectively absorbs
mechanical stresses induced by
assembly-level CTE mismatch and shock
and vibration while providing exceptional
thermal performance and long-term
adhesion and dielectric integrity.
Bond-Ply
®
LMS 500P is typically used for
bonding power components and PCBs to
a heatsink. See application note for
lamination recommendations.
Shelf Life:
The Bond-Ply
®
LMS 500P is a
heat-cured material and should be stored
in temperature-controlled conditions. A
recommended storage temperature range
of 5-25°C should be used to maintain
optimum characteristics for 5 months.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
PDS_BP_LMS 500P_April 2012
CONFIGURATIONS AVAILABLE
• Roll form
• Sheet form
• Die-cut parts
TDS Bond-Ply
®
LMS 500P, April 2012
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In
case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user’s responsibility to
determine suitability for the user’s purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing,
Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits.
The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office
Reference 0.1
Americas
+1.800.347.4572
Europe
+31.35.5380684
For the most direct access to local sales and technical support visit: www.bergquistcompany.com
Asia
+852.2690.9296
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