Si1330EDL-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
a
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
a
Maximum Power Dissipation
a
Operating Junction and Storage Temperature Range
T
A
= 25 °C
T
A
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
J
, T
stg
0.26
0.31
0.20
- 55 to 150
0.25
0.2
1.0
0.23
0.28
0.18
W
°C
5s
60
± 20
0.24
0.19
A
Steady State
Unit
V
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a
Maximum Junction-to-Foot (Drain)
Notes:
a. Surface mounted on 1" x 1" FR4 board.
t
≤
5s
Steady State
Steady State
Symbol
R
thJA
R
thJF
Typical
355
380
285
Maximum
400
450
340
°C/W
Unit
Document Number: 72861
S10-0721-Rev. B, 29-Mar-10
www.vishay.com
1
Si1330EDL
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
a
Limits
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
V
DS
V
GS(th)
I
GSS
I
DSS
V
GS
= 0 V, I
D
= 10 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 10 V
V
DS
= 60 V, V
GS
= 0 V
V
DS
= 60 V, V
GS
= 0 V, T
J
= 55 °C
V
GS
= 10 V, V
DS
= 7.5 V
On-State Drain Current
b
I
D(on)
V
GS
= 4.5 V, V
DS
= 10 V
V
GS
= 3 V, V
DS
= 10 V
V
GS
= 10 V, I
D
= 0.25 A
Drain-Source On-Resistance
b
Forward Transconductance
Diode Forward Voltage
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Time
Turn-Off Time
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 30 V, R
L
= 150
Ω
I
D
≅
0.2 A, V
GEN
= 10 V
R
g
= 10
Ω
0.4
V
DS
= 10 V, V
GS
= 4.5 V
I
D
≅
0.25 A
0.11
0.15
173
3.8
4.8
12.8
9.6
10
15
20
15
ns
Ω
0.6
nC
b
Symbol
Test Conditions
Min.
60
1
Typ.
Max.
Unit
2.0
2.5
±1
1
10
V
µA
0.5
0.4
0.05
1.0
1.4
3.0
350
0.83
1.2
2.5
3
8
mS
V
Ω
A
R
DS(on)
g
fs
V
SD
V
GS
= 4.5 V, I
D
= 0.2 A
V
GS
= 3 V, I
D
= 0.025 A
V
DS
= 10 V, I
D
= 0.25 A
I
S
= 0.23 A, V
GS
= 0 V
Notes:
a. Pulse test: PW
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
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