Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI80N06S2L-11
MA000275611
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
4.533
0.851
0.255
849.682
5.591
8.806
96.869
481.409
15.198
0.228
0.001
0.087
0.069
3.312
0.032
0.106
106.210
Average
Mass
[%]
0.29
0.05
0.02
54.00
0.36
0.56
6.16
30.60
0.97
0.01
0.00
0.01
0.00
0.21
0.00
0.01
6.75
29. August 2013
1573.24 mg
Sum
[%]
0.29
Average
Mass
[ppm]
2882
541
162
54.07
0.36
540083
3554
5598
61573
37.32
0.97
305999
9660
145
0.01
1
55
44
0.22
2105
20
68
6.76
67510
67598
1000000
2204
145
373170
9660
540787
3554
Sum
[ppm]
2882
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
ARM技术
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