1. The device must not burn to open−circuit, when the value is below maximum I
PP
.
2. This parameter is characterized at 25°C using an ON Semiconductor−specific test board.
Rating
4
100
Units
A
A
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
R
OPEN
t
FUSE
t
LIFE
I
OFF
Parameter
Resistance A1
−
A2
Resistance after open fuse
Fusing time
Fuse life time
Stand−off quiescent current
Conditions
B1 and B2 floating; T
A
= 25°C
(Note 2)
B1 and B2 floating; T
A
= 25°C
B1 and B2 floating; I = 5 A; T
A
= 25°C
(Note 3)
B1 and B2 floating; I = 2 A; T
A
= 25°C
(Notes 3 and 4)
From A1 pin to B1 and B2 pins;
Stand−off voltage V
OFF
= 8 V;
T
A
= 25°C
From A1 pin to B1 and B2 pins;
Break down current I
BR
= 15 mA
From A1 pin to B1 and B2 pins;
Clamping current I
CL
= 1 A
(Note 5)
From A1 pin to B1 and B2 pins;
Forward current I
F
= 850 mA
V
BIAS
= 0 V
V
BIAS
= 5 V; T
A
= 25°C
ESD protection peak discharge
Voltage at
A1 pin or A2 to B1 and B2
a) Contact Discharge per IEC 61000−4−2
standard
b) Air Discharge per IEC 61000−4−2 standard
Minimum attenuation
Freq = 80 MHz
−
1 GHz
Freq = 1
−
4 GHz
T
A
= 25°C
(Note 6)
108
280
135
10
13.5
4000
100
1
100
Min
Typ
Max
50
Units
mW
MW
ms
Hours
nA
V
BR
V
CL
Break down voltage
Clamping voltage during transient
V
V
V
F
C
L1
C
L2
V
ESD
Forward voltage
Line capacitance
1.3
V
pF
pF
kV
±30
±30
f
C
R
SOURCE
= R
LOAD
= 50
W
T
A
= 25°C
12
20
dB
1.
2.
3.
4.
5.
6.
All parameters specified for T
A
=
−30°C
to 85°C unless otherwise noted.
This parameter is measured using low current to avoid self−heating.
These parameters are characterized using ON Semiconductor−specific test boards.
Fuse is considered failed when its resistance is higher than 1
W.
Transient: 8 x 20
ms
current pulse.
Standard IEC 61000−4−2 with C
Discharge
= 150 pF, R
Discharge
= 330
W.
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2
CM6114
RF CHARACTERISTICS
T
A
= 255C, 50
W
Environment
0 dB
-10 dB
5V
INSERTION LOSS
-20 dB
0V
−30
dB
-40 dB
-50 dB
3
10
100
FREQUENCY (MHz)
1000
2000
6000
Figure 1. Insertion Loss (0 V and 5 V Bias)
MECHANICAL SPECIFICATION
Table 5. VERTICAL STRUCTURE DIMENSIONS
(nominal)
Ref.
a
h
j
Parameter
Die Thickness
Dielectric Layer 1
Dielectric Layer 2
UBM−(Ti/Cu)
d
Material
Silicon
Polyimide
Polyimide
Plated Cu
Sputtered Cu
Sputtered Ti
e
b
f
c
g
D2
D1
Total Thickness
UBM Wetting Area
Diameter
Bump Standoff
Solder Bump Diameter
after Bump Reflow
Metal Pad Height
Metal Pad Diameter
AlSiCu
Dimension
389
mm
7
mm
10
mm
6.5
mm
0.4
mm
0.1
mm
240
mm
194
mm
270
mm
1.5
mm
60
mm
0.406 mm
0.600 mm
Vertical Structure Specification*
Figure 2. Sectional View
* Daisy Chain CM6040
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3
CM6114
PACKAGE DIMENSIONS
WLCSP4, 0.8x0.8
CASE 567CB−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
b
D
E
e
MILLIMETERS
MIN
MAX
0.63
0.57
0.17
0.24
0.41 REF
0.24
0.29
0.80 BSC
0.80 BSC
0.40 BSC
D
A
B
2X
2X
0.05 C
0.05 C
0.05 C
A
0.05 C
NOTE 3
A1
4X
b
B
A
1
2
0.05 C A B
0.03 C
BOTTOM VIEW
Application Specific Integrated Passive
is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
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For additional information, please contact your local
Sales Representative
ÈÈ
ÈÈ
PIN A1
REFERENCE
E
TOP VIEW
A2
RECOMMENDED
SOLDERING FOOTPRINT*
C
SEATING
PLANE
SIDE VIEW
A1
PACKAGE
OUTLINE
e
e
0.40
PITCH
4X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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