IC 512K X 8 STANDARD SRAM, 150 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | TSOP2 |
包装说明 | 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32 |
针数 | 32 |
Reach Compliance Code | unknown |
最长访问时间 | 150 ns |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e0 |
长度 | 20.95 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 512KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
TC554001AFTI-85V | TC554001AFI-85V | TC554001AFI-70V | TC554001AFI-10V | TC554001ATRI-85V | TC554001AFTI-70V | TC554001AFTI-10V | TC554001ATRI-70V | TC554001ATRI-10V | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC 512K X 8 STANDARD SRAM, 150 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 85 ns, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32, Static RAM | IC 512K X 8 STANDARD SRAM, 70 ns, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32, Static RAM | IC 512K X 8 STANDARD SRAM, 100 ns, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32, Static RAM | IC 512K X 8 STANDARD SRAM, 85 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 150 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 100 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 150 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, REVERSE, PLASTIC, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 100 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Static RAM |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP2 | SOIC | SOIC | SOIC | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32 | SOP, SOP32,.56 | SOP, SOP32,.56 | SOP, SOP32,.56 | TSOP2, TSOP32,.46 | 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32 | TSOP2, TSOP32,.46 | 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-32 | TSOP2, TSOP32,.46 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
最长访问时间 | 150 ns | 85 ns | 70 ns | 100 ns | 85 ns | 150 ns | 100 ns | 150 ns | 100 ns |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
长度 | 20.95 mm | 20.6 mm | 20.6 mm | 20.6 mm | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOP | SOP | SOP | TSOP2 | TSOP2 | TSOP2 | TSOP2-R | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 2.8 mm | 2.8 mm | 2.8 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2.7 V | 4.5 V | 2.7 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.7 mm | 10.7 mm | 10.7 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | Toshiba(东芝) | - | - | - | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | - |
ECCN代码 | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A | - | 3A991.B.2.A |
I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | - | COMMON | - | COMMON |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE |
封装等效代码 | - | SOP32,.56 | SOP32,.56 | SOP32,.56 | TSOP32,.46 | - | TSOP32,.46 | - | TSOP32,.46 |
电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | - | 3/5 V |
最大待机电流 | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | - | 0.000005 A | - | 0.000005 A |
最小待机电流 | - | 2 V | 2 V | 2 V | 2 V | - | 2 V | - | 2 V |
最大压摆率 | - | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | - | 0.07 mA | - | 0.07 mA |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved