SIPO Based Peripheral Driver, 0.04A, BCDMOS, PDIP18, PLASTIC, DIP-18
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SOURCE AND SINK |
| 标称输出峰值电流 | 0.04 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5/12,60 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.937 mm |
| 最大供电电压 | 12 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 电源电压1-最大 | 60 V |
| 表面贴装 | NO |
| 技术 | BCDMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MIC5810BN | MIC5810BWMT&R | MIC5810BWM | |
|---|---|---|---|
| 描述 | SIPO Based Peripheral Driver, 0.04A, BCDMOS, PDIP18, PLASTIC, DIP-18 | SIPO Based Peripheral Driver, 0.04A, PDSO18, 0.300 INCH, SOIC-18 | SIPO Based Peripheral Driver, 0.04A, BCDMOS, PDSO18, 0.300 INCH, SOIC-18 |
| 零件包装代码 | DIP | SOIC | SOIC |
| 包装说明 | DIP, DIP18,.3 | SOP, | SOP, SOP18,.4 |
| 针数 | 18 | 18 | 18 |
| Reach Compliance Code | compliant | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G18 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
| 标称输出峰值电流 | 0.04 A | 0.04 A | 0.04 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.937 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 | 12 V | 12 V | 12 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 电源电压1-最大 | 60 V | 60 V | 60 V |
| 表面贴装 | NO | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm |
| 是否Rohs认证 | 不符合 | - | 不符合 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) |
| JESD-609代码 | e0 | - | e0 |
| 封装等效代码 | DIP18,.3 | - | SOP18,.4 |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | 240 |
| 电源 | 5/12,60 V | - | 5/12,60 V |
| 技术 | BCDMOS | - | BCDMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED |
| 长度 | - | 11.55 mm | 11.55 mm |
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