CM1681
2 Channel EMI Filter with
ESD Protection for
Headsets/Speakers
Features
•
Two Channels of EMI Filtering
•
Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
•
•
•
•
•
•
•
Network
±8
kV ESD Protection (IEC 61000−4−2, Contact Discharge)
±15
kV ESD Protection (HBM)
Supports AC Signals
−
Ideal for Audio Applications
Greater than 40 dB of Attenuation at 1 GHz
8−Lead, 2.00 mm x 2.00 mm Footprint CUDFN Package
Low Profile Height of 0.5 mm
These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
CUDFN8
DE SUFFIX
CASE 505AF
MARKING DIAGRAM
P81
Applications
•
Headset Speaker Port in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook Computers,
P81
= CM1681−02DE
PDAs, etc.
•
EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
ORDERING INFORMATION
Device
CM1681−02DE
Package
CUDFN−8
(Pb−Free)
Shipping
†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
ELECTRICAL SCHEMATIC
Filter #1
1
10
W
8
100 pF
C
Filter #1
100 pF
C
R
Filter #2
4
10
W
5
100 pF
C
Filter #2
100 pF
C
R
©
Semiconductor Components Industries, LLC, 2011
April, 2011
−
Rev. 3
1
Publication Order Number:
CM1681/D
CM1681
Table 1. PIN DESCRIPTIONS
8−Lead CUDFN Package
Pin
1
2
3
4
5
6
7
8
GND
PAD
Name
Filter #1
NC
NC
Filter #2
Filter #2
NC
NC
Filter #1
GND
Filter #1
No connect
No connect
Filter #2
Filter #2
No connect
No connect
Filter #1
Ground
1 2 3 4
8 7 6
5
Pin 1
Marking
GND
PAD
Description
PACKAGE / PINOUT DIAGRAMS
Top View
(Pins Down View)
8 7 6 5
Bottom View
(Pins Up View)
1 2 3
4
8−Lead CUDFN Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC package power rating
Rating
−65
to +150
0.5
Units
°C
W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40
to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
R
MATCH
C
TOT
C
I
LEAK
V
SIG
Resistance R
Resistor−to−Resistor Matching
Total Channel Capacitance
Capacitance C
Diode Leakage Current
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage:
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
Cut−off frequency
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
V
IN
=
±5.0
V
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Note 2)
5
−15
±15
±8
31
2.5 V DC; 1 MHz, 30 mV AC
160
200
100
0.1
7
−10
1.0
15
−5
Parameter
Conditions
Min
8
Typ
10
Max
12
5
240
Units
W
%
pF
pF
mA
V
V
ESD
kV
f
C
R = 10
W,
C = 100 pF
MHz
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter
to the ESD pin (i.e. if ESD is applied to pin 1 then clamping voltage is measured at pin 8).
http://onsemi.com
2
CM1681
PACKAGE DIMENSIONS
CUDFN8, 2x2, 0.5P
CASE 505AF−01
ISSUE O
D
A B
PIN ONE
REFERENCE
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.10 AND 0.20mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D1
D2
E
E2
e
K
L
M
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.55
0.65
0.00
0.05
0.20 REF
0.15
0.25
2.00 BSC
1.80 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.20
---
0.25
0.35
---
10
5
2X
2X
0.10 C
0.10 C
D1
TOP VIEW
DETAIL A
END VIEW
M
A3
A
A1
0.10 C
0.08 C
NOTE 4
SIDE VIEW
D2
1
4
8X
DETAIL A C
L
RECOMMENDED
MOUNTING FOOTPRINT*
1.70
0.52
8X
E2
1.00
K
e
e/2
BOTTOM VIEW
8
5
8X
2.30
b
0.10 C A
0.05 C
B
NOTE 3
1
0.50
PITCH
0.27
DIMENSIONS: MILLIMETERS
8X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
4
CM1681/D
NXP MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
