CAT93C86 (Rev. C)
16K-Bit Microwire Serial EEPROM
FEATURES
High speed operation: 3 MHz
Low power CMOS technology
1.8 to 5.5 volt operation
Selectable x8 or x16 memory organization
Self-timed write cycle with auto-clear
Hardware and software write protection
Power-up inadvertant write protection
Sequential read
Program enable (PE) pin
1,000,000 Program/erase cycles
100 year data retention
Commercial, industrial and automotive
temperature ranges
RoHS-compliant packages
DESCRIPTION
The CAT93C86 is a 16K-bit Serial EEPROM memory
device which is configured as either registers of 16
bits (ORG pin at V
CC
) or 8 bits (ORG pin at GND).
Each register can be written (or read) serially by using
the DI (or DO) pin. The CAT93C86 is manufactured
using Catalyst’s advanced CMOS EEPROM floating
gate technology. The device is designed to endure
1,000,000 program/erase cycles and has a data
retention of 100 years. The device is available in 8-pin
DIP, 8-pin SOIC and 8-pad TDFN packages.
PIN CONFIGURATION
PDIP (L)
SOIC (V, X)
TDFN (ZD4)
CS
SK
DI
DO
1
2
3
4
8 V
CC
7 PE
6 ORG
5 GND
PE
V
CC
CS
SK
FUNCTIONAL SYMBOL
V
CC
SOIC (W)
1
2
3
4
8 ORG
7 GND
6 DO
5 DI
ORG
CS
SK
PE
DI
DO
GND
PIN FUNCTION
Pin Name
CS
SK
DI
DO
V
CC
GND
ORG
PE
(1)
Function
Chip Select
Clock Input
Serial Data Input
Serial Data Output
Power Supply
Ground
Memory Organization
Program Enable
For Ordering Information details, see page 12.
Notes:
(1) When the ORG pin is connected to V
CC
, x16 organization is
selected. When it is connected to ground, x8 pin is selected.
If the ORG pin is left unconnected, then an internal pull-up
device will select the x16 organization.
© 2009 SCILLC. All rights reserved
Characteristics subject to change without notice
1
Doc. No. MD-1091 Rev. S
CAT93C86 (Rev. C)
ABSOLUTE MAXIMUM RATINGS
Parameters
Temperature Under Bias
Storage Temperature
Voltage on any Pin with Respect to Ground
V
CC
with Respect to Ground
Package Power Dissipation Capability (T
A
= 25ºC)
Lead Soldering Temperature (10 seconds)
Output Short Circuit Current
(3)
(2)
(1)
Ratings
–55 to +125
–65 to 150
-2.0 to +V
CC
+2.0
-2.0 to +7.0
1.0
300
100
Units
ºC
ºC
V
V
W
ºC
mA
RELIABILITY CHARACTERISTICS
Symbol
N
END(4)
T
DR(4)
V
ZAP(4)
I
LTH(4)(5)
Parameter
Endurance
Data Retention
ESD Susceptibility
Latch-Up
Reference Test Method
MIL-STD-883, Test Method 1033
MIL-STD-883, Test Method 1008
MIL-STD-883, Test Method 3015
JEDEC Standard 17
Min
1,000,000
100
2000
100
Units
Cycles/Byte
Years
V
mA
D.C. OPERATING CHARACTERISTICS
V
CC
= +1.8 V to +5.5 V unless otherwise specified.
Symbol
I
CC1
I
CC2
I
SB1
I
SB2
I
LI
I
LO
V
IL1
V
IH1
V
IL2
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
Parameter
Power Supply Current (Write)
Power Supply Current (Read)
Power Supply Current
(Standby) (x8 Mode)
Power Supply Current
(Standby) (x16Mode)
Input Leakage Current
Output Leakage Current
(Including ORG pin)
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage
Test Conditions
f
SK
= 1 MHz; V
CC
= 5.0 V
f
SK
= 1 MHz; V
CC
= 5.0 V
CS = 0 V ORG = GND
CS = 0 V ORG = Float or V
CC
V
IN
= 0 V to V
CC
V
OUT
= 0 V to V
CC
, CS = 0 V
4.5 V
≤
V
CC
< 5.5 V
4.5 V
≤
V
CC
< 5.5 V
1.8 V
≤
V
CC
< 4.5 V
1.8 V
≤
V
CC
< 4.5 V
4.5 V
≤
V
CC
< 5.5 V; I
OL
= 2.1 mA
4.5 V
≤
V
CC
< 5.5 V; I
OH
= -400 µA
1.8 V
≤
V
CC
< 4.5 V; I
OL
= 1 mA
1.8 V
≤
V
CC
< 4.5 V; I
OH
= -100 µA
Min
Typ
Max
3
500
10
Units
mA
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
0
10
1
1
-0.1
2
0
V
CC
x 0.7
2.4
0.8
V
CC
+ 1
V
CC
x 0.2
V
CC
+ 1
0.4
0.2
V
CC
- 0.2
Notes:
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
(2) The minimum DC input voltage is –0.5 V. During transitions, inputs may undershoot to –2.0 V for periods of less than 20 ns. Maximum DC
voltage on output pins is V
CC
+0.5 V, which may overshoot to V
CC
+2.0 V for periods of less than 20 ns.
(3) Output shorted for no more than one second. No more than one output shorted at a time.
(4) These parameters are tested initially and after a design or process change that affects the parameter.
(5) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1 V to V
CC
+1 V.
Doc. No. MD-1091 Rev. S
2
© 2009 SCILLC. All rights reserved
Characteristics subject to change without notice
CAT93C86 (Rev. C)
PIN CAPACITANCE
Symbol
C
OUT
C
IN
Test
Output Capacitance (DO)
Input Capacitance (CS, SK, DI, ORG)
(1)
Conditions
V
OUT
= 0 V
V
IN
= 0 V
Min
Typ
Max
5
5
Units
pF
pF
POWER-UP TIMING
(1)(2)
Symbol
t
PUR
t
PUW
Parameter
Power-up to Read Operation
Power-up to Write Operation
Max
1
1
Units
ms
ms
A.C. TEST CONDITIONS
Input Rise and Fall Times
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
A.C. CHARACTERISTICS
Test
Conditions
V
CC
=
1.8 V - 5.5 V
Min
200
0
200
200
1
C
L
= 100
F
(3)
1
400
5
1
1
1
1
DC
500
DC
0.5
0.5
0.5
0.5
1000
DC
Max
V
CC
=
2.5 V - 5.5 V
Min
100
0
100
100
0.5
0.5
200
5
0.15
0.15
0.15
0.1
3000
Max
V
CC
=
4.5 V - 5.5 V
Min
50
0
50
50
0.15
0.15
100
5
Max
Units
ns
ns
ns
ns
µs
µs
ns
ms
µs
µs
µs
µs
kHz
≤
50 ns
0.4 V to 2.4 V
0.8 V, 2.0 V
0.2 x V
CC
to 0.7 x V
CC
0.5 x V
CC
4.5 V
≤
V
CC
≤
5.5 V
4.5 V
≤
V
CC
≤
5.5 V
1.8 V
≤
V
CC
≤
4.5 V
1.8 V
≤
V
CC
≤
4.5 V
Symbol Parameter
t
CSS
t
CSH
t
DIS
t
DIH
t
PD1
t
PD0
t
HZ(1)
t
EW
t
CSMIN
t
SKHI
t
SKLOW
t
SV
SK
MAX
CS Setup Time
CS Hold Time
DI Setup Time
DI Hold Time
Output Delay to 1
Output Delay to 0
Output Delay to High-Z
Program/Erase Pulse Width
Minimum CS Low Time
Minimum SK High Time
Minimum SK Low Time
Output Delay to Status Valid
Maximum Clock Frequency
Notes:
(1) These parameters are tested initially and after a design or process change that affects the parameter.
(2)
(3)
t
PUR
and t
PUW
are the delays required from the time V
CC
is stable until the specified operation can be initiated.
The input levels and timing reference points are shown in the “AC Test Conditions” table.
3
© 2009 SCILLC. All rights reserved
Characteristics subject to change without notice
Doc. No. MD-1091 Rev. S
CAT93C86 (Rev. C)
INSTRUCTION SET
Instruction
READ
ERASE
WRITE
EWEN
EWDS
ERAL
WRAL
Start
Bit
1
1
1
1
1
1
1
Address
Opcode
10
11
01
00
00
00
00
x8
A10-A0
A10-A0
A10-A0
11XXXXXXXXX
00XXXXXXXXX
10XXXXXXXXX
01XXXXXXXXX
x16
A9-A0
A9-A0
A9-A0
11XXXXXXXX
00XXXXXXXX
10XXXXXXXX
01XXXXXXXX
D7-D0
D15-D0
D7-D0
D15-D0
x8
Data
x16
Comments
Read Address AN– A0
Clear Address AN– A0
Write Address AN– A0
Write Enable
Write Disable
Clear All Addresses
Write All Addresses
DEVICE OPERATION
The CAT93C86 is a 16,384-bit nonvolatile memory
intended
for
use
with
industry
standard
microprocessors. The CAT93C86 can be organized
as either registers of 16 bits or 8 bits. When organized
as X16, seven 13-bit instructions control the reading,
writing and erase operations of the device. When
organized as X8, seven 14-bit instructions control the
reading, writing and erase operations of the device.
The CAT93C86 operates on a single power supply
and will generate on chip, the high voltage required
during any write operation.
Instructions, addresses, and write data are clocked
into the DI pin on the rising edge of the clock (SK).
The DO pin is normally in a high impedance state
except when reading data from the device, or when
checking the ready/busy status after a write operation.
The ready/busy status can be determined after the
start of a write operation by selecting the device (CS
high) and polling the DO pin; DO low indicates that the
write operation is not completed, while DO high
indicates that the device is ready for the next
instruction. If necessary, the DO pin may be placed
back into a high impedance state during chip select by
shifting a dummy “1” into the DI pin. The DO pin will
enter the high impedance state on the falling edge of
the clock (SK). Placing the DO pin into the high
impedance state is recommended in applications
where the DI pin and the DO pin are to be tied
together to form a common DI/O pin.
The format for all instructions sent to the device is a
logical “1” start bit, a 2-bit (or 4-bit) opcode, 10-bit
address (an additional bit when organized X8) and for
write operations a 16-bit data field (8-bit for X8
organizations).
Note: The Write, Erase, Write all and Erase all
instructions require PE=1. If PE is left floating, 93C86
is in Program Enabled mode. For Write Enable and
Write Disable instruction PE = don’t care.
Read
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the CAT93C86
will come out of the high impedance state and, after
sending an initial dummy zero bit, will begin shifting
out the data addressed (MSB first). The output data
bits will toggle on the rising edge of the SK clock and
are stable after the specified time delay (t
PD0
or t
PD1
).
After the initial data word has been shifted out and CS
remains asserted with the SK clock continuing to
toggle, the device will automatically increment to the
next address and shift out the next data word in a
sequential READ mode. As long as CS is
continuously asserted and SK continues to toggle, the
device will keep incrementing to the next address
automatically until it reaches to the end of the address
space, then loops back to address 0.
In the
sequential READ mode, only the initial data word is
preceeded by a dummy zero bit. All subsequent data
words will follow without a dummy zero bit.
Write
After receiving a WRITE command, address and the
data, the CS (Chip Select) pin must be deselected for
a minimum of t
CSMIN
. The falling edge of CS will start
the self clocking clear and data store cycle of the
memory location specified in the instruction. The
clocking of the SK pin is not necessary after the
device has entered the self clocking mode. The
ready/busy status of the CAT93C86 can be
determined by selecting the device and polling the DO
pin. Since this device features Auto-Clear before
write, it is NOT necessary to erase a memory location
before it is written into.
Doc. No. MD-1091 Rev. S
4
© 2009 SCILLC. All rights reserved
Characteristics subject to change without notice
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