IC IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,CERAMIC, Switching Regulator or Controller
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 包装说明 | DIP, DIP8,.3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 控制模式 | CURRENT-MODE |
| JESD-30 代码 | R-XDIP-T8 |
| JESD-609代码 | e0 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 0.2 A |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 最大切换频率 | 500 kHz |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| LT1243MJ8/883C | LT1241MJ8/883 | LT1241MJ8/883C | LT1245MJ8/883C | LT1242MJ8/883 | LT1242MJ8/883C | |
|---|---|---|---|---|---|---|
| 描述 | IC IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,CERAMIC, Switching Regulator or Controller | LT1241MJ8/883 | IC IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,CERAMIC, Switching Regulator or Controller | IC IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,CERAMIC, Switching Regulator or Controller | LT1242MJ8/883 | IC IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,CERAMIC, Switching Regulator or Controller |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| JESD-30 代码 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最大输出电流 | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 最大切换频率 | 500 kHz | 500 kHz | 500 kHz | 500 kHz | 500 kHz | 500 kHz |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | - | 含铅 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | - |
| 包装说明 | DIP, DIP8,.3 | - | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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