NCV894630
2 A - 2.1 MHz High
Efficiency Low Voltage
Step-Down Converter
The NCV894630 step−down dc−dc converter is a monolithic
integrated circuit dedicated to automotive driver information systems
from a downstream voltage rail. The output voltage is externally
adjustable from 0.9 V to 3.3 V and can source up to 2 A. The converter
is running at a 2.1 MHz switching frequency, above the sensitive AM
band. The NCV894630 provides additional features expected in
automotive power systems such as integrated soft−start, hiccup mode
current limit and thermal shutdown protection. The device can also be
synchronized to an external clock signal in the range of 2.1 MHz. The
NCV894630 is available in the same 3x3 mm 10−pin DFN package as
the dual NCV896530, with compatible pin−out.
Features
www.onsemi.com
MARKING
DIAGRAM
NCV89
4630
ALYW
DFN10
CASE 485C
NCV89
4630
A
L
Y
W
G
. .
•
•
•
•
•
•
•
•
•
Synchronous Rectification for Higher Efficiency
2.1 MHz Switching Frequency
Sources up to 2 A
Adjustable Output Voltage from 0.9 V to 3.3 V
2.7 V to 5.5 V Input Voltage Range
Thermal Limit and Short Circuit Protection
Auto Synchronizes with an External Clock
Wettable Flanks − DFN
Negative Current Limit for Low Side MOSFET to Prevent Inductor
Current Recirculating
•
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
FB
EN
SYNC
VIN
SW
1
2
3
4
5
(Top View)
10
9
8
7
6
GND
NC
POR
GND
NC
•
•
•
•
Audio
Infotainment
Safety − Vision System
Instrumentation
ORDERING INFORMATION
Device
NCV894630MWTXG
Package
DFN10
(Pb−Free)
Shipping
†
3000/Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2015
1
September, 2015 − Rev. 1
Publication Order Number:
NCV894630/D
NCV894630
V
in
C
in
20
mF
NCV894630
SYNC
1.8
−
2.7 MHz
OFF ON
EN
POR
GND
FB
L
2.2
mH
V
in
SW
V
out
C
out
20
mF
V
DD
C
1
R
1
V
in
or V
out
R
2
R
POR
Microprocessor
RESET
Figure 1. NCV894630 Typical Application
www.onsemi.com
2
NCV894630
BLOCK DIAGRAM
V
in
UVLO
CURRENT
LIMIT
SOFTSTART
EN
ENABLE
THERMAL
SHUTDOWN
REFERENCE
LOGIC and
PWM LATCH
POR
SW
EA
FB
SYNC
SLOPE
COMPENSATON
OSCILLATOR
GND
Figure 2. Simplified Block Diagram
PIN FUNCTION DESCRIPTION
Pin
1
2
3
4
5
6
7
8
Pin Name
FB
EN
SYNC
VIN
SW
NC
GND
POR
Type
Analog Input
Digital Input
Digital Input
Analog / Power
Input
Power Output
−
Analog / Power
Ground
Digital Output
Description
Feedback voltage. This is the input to the error amplifier.
Enable. This pin is active HIGH (equal or lower Analog Input voltage) and is turned
off by logic LOW. Do not let this pin float.
Oscillator Synchronization. This pin can be synchronized to an external clock in the
range of 2.1 MHz. If not used, the pin must be connected to ground.
Power supply input for the PFET power stage, analog and digital blocks. The pin
must be decoupled to ground by a 10
mF
ceramic capacitor.
Connection from power MOSFETs of output to the Inductor.
−
This pin is the GROUND reference for the analog section of the IC. The pin must be
connected to the system ground. Both pins must be connected together on PCB.
Power On Reset. This is an open drain output. This output is shutting down when the
output voltage is less than 90% (typ) of their nominal values. An external pull−up
resistor should be connected between POR and V
IN
or V
OUT
depending on the
supplied device.
−
Connect to Ground
Connected to GND potential.
9
10
EPAD
NC
GND
EPAD
−
Analog Ground
Exposed Pad
www.onsemi.com
3
NCV894630
ABSOLUTE MAXIMUM RATINGS
(Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.)
Rating
Input Voltage
SW Voltage
Enable Input Voltage
Feedback Input Voltage
Oscillator Synchronization Input Voltage
Power On Reset Voltage
Junction Temperature
Storage Temperature
Symbol
V
in
V
SW
V
EN
V
FB
V
SYNC
V
POR
T
J
T
STG
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−40
−55
Max
6.0
6 V (or V
in
+ 0.3 V)*
6 V (or V
in
+ 0.3 V)*
6 V (or V
in
+ 0.3 V)*
6V
6 V (or V
in
+ 0.3 V)*
150
150
Unit
V
V
V
V
V
V
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*Whichever is lower.
ESD CAPABILITY
(Note 1)
Rating
ESD Capability, Human Body Model
ESD Capability, Machine Model
Symbol
ESD
HBM
ESD
MM
Min
−2
−200
Max
2
200
Unit
kV
V
1. This device series incorporates ESD portection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
LEAD SOLDERING TEMPERATURE AND MSL
(Note 2)
Rating
Moisture Sensitivity Level
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
Symbol
MSL
T
SLD
−
Min
3
265 peak
Max
Unit
per IPC
°C
2. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, DFN10 (Note 3)
Thermal Resistance, Junction−to−Air
Symbol
R
qJA
Value
40
Unit
°C/W
3. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate.
www.onsemi.com
4
NCV894630
(2.7 V < V
IN
< 5.5 V, Min and Max values are valid for the temperature range −40°C
≤
T
J
≤
+150°C unless noted otherwise, and are
guaranteed by test, design or statistical correlation. Typical values are referenced to T
A
= +25°C)
Rating
INPUT VOLTAGE
Quiescent Current
Shutdown Current
Under Voltage Lockout
Under Voltage Hysteresis
SYNC
SYNC Threshold Voltage
Logic Low
Logic High
SYNC Input Current
External Synchronization
SYNC Pulse Duty Ratio
ENABLE
Enable Threshold Voltage
Logic Low
Logic High
Enable Input Current
POWER ON RESET
Power On Reset Threshold
Power On Reset Hysteresis
POR Sink Current
FEEDBACK VOLTAGE
Feedback Voltage
(Accuracy %)
Soft−Start Time
SWITCHING FREQUENCY
Switching Frequency
Duty Cycle
Minimum On Time
POWER SWITCHES
High−Side MOSFET On−Resistance
Low−Side MOSFET On−Resistance
High−Side MOSFET Leakage Current
Low−Side MOSFET Leakage Current
CURRENT LIMIT PROTECTION
Current Limit
Negative Current Limit
THERMAL SHUTDOWN
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Guaranteed by Design
Guaranteed by Design
T
SD
T
SH
150
5.0
170
−
190
20
°C
°C
Peak Inductor Current
(100% duty cycle)
I
PK
I
NPK
3.0
−
−
200
4.0
−
A
mA
I
RDS(on)
= 0.6 A, V
IN
= 5 V,
T
J
= 25°C
I
RDS(on)
= 0.6 A, V
IN
= 5 V,
T
J
= 25°C
V
IN
= 5 V, V
SW
= 0 V, V
EN
= 0 V
V
SW
= 5 V, V
EN
= 0 V
R
DS(on)H
R
DS(on)L
I
DS(off)H
I
DS(off)L
−
−
−
−
300
300
−
−
550
550
5.0
5.0
mW
mW
mA
mA
F
SW
D
T
ONmin
1.8
−
−
2.1
−
−
2.4
100
80
MHz
%
ns
T
J
= −40°C to 125°C
Time from EN to 90% of V
FB
V
FB
t
SS
0.591
(−1.5%)
1700
0.6
2000
0.609
(+1.5%)
3200
V
ms
V
POR
= 0.4 V
V
OUT
falling
V
PORT
V
PORH
I
POR
87
−
2.0
90
−
−
93
3.0
−
%Vout
%Vout
mA
V
EN
= 5 V
V
V
ILEN
V
IHEN
I
EN
−
1.2
2
−
−
−
0.4
−
50
mA
V
SYNC
= 5 V
V
V
ILSYNC
V
IHSYNC
I
SYNC
f
SYNC
D
SYNC
−
1.2
2.0
1.8
−
−
−
−
−
50
0.4
−
50
2.7
−
mA
MHz
%
SYNC = GND, V
FB
= 0 V, EN = 2 V,
(No Switching)
EN = 0 V
V
IN
falling
I
q
I
OFF
V
UVLO
V
UVLOH
−
−
2.2
−
1.0
−
2.4
100
2.0
10
2.6
150
mA
mA
V
mV
Conditions
Symbol
Min
Typ
Max
Unit
ELECTRICAL CHARACTERISTICS
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
5