Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
ESD101-B1-02EL E6327
MA001115174
PG-TSLP-2-20
Material Group
non noble metal
noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
< 10%
Substances
tin
gold
silicon
nickel
gold
carbon black
epoxy resin
silicondioxide
gold
palladium
gold
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-02-0
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-05-3
7440-57-5
Issued
Weight*
Weight
[mg]
0.001
0.003
0.020
0.241
0.006
0.002
0.047
0.273
0.010
0.000
0.000
Average
Mass
[%]
0.12
0.45
3.34
40.04
0.92
0.27
7.74
45.37
1.73
0.01
0.01
29. August 2013
0.60 mg
Sum
[%]
Average
Mass
[ppm]
1160
4502
3.91
40.04
0.92
33356
400363
9215
2669
77415
53.38
1.73
453808
17336
68
0.02
108
176
1000000
533892
17336
39018
400363
9215
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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