Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BAS 21-03W E6327
MA001094556
PG-SOD323-2-1
Material Group
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
inorganic material
organic material
plastics
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
arsenic
gold
silicon
chromium
silicon
titanium
copper
gold
antimonytrioxide
carbon black
brominated resin
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-38-2
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-57-5
1309-64-4
1333-86-4
-
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.006
0.051
0.004
0.000
0.001
1.387
0.006
0.032
0.032
0.078
0.725
2.023
0.076
0.041
Average
Mass
[%]
0.00
0.13
1.15
0.09
0.01
0.03
31.08
0.13
0.71
0.71
1.75
16.25
45.34
1.71
0.91
29. August 2013
4.46 mg
Sum
[%]
Average
Mass
[ppm]
14
1348
1.28
11511
936
63
312
31.21
0.13
310791
1303
7123
7123
17485
162541
64.76
1.71
0.91
453304
17061
9085
647576
17061
9085
1000000
312102
1303
12873
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
NXP MCU
京公网安备 11010802033920号
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