Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB180N10S4-02
MA001074084
PG-TO263-7-3
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
12.330
0.803
0.241
801.714
13.372
8.607
94.677
470.515
12.317
0.269
0.001
0.194
0.155
7.409
0.032
0.106
106.210
Average
Mass
[%]
0.81
0.05
0.02
52.44
0.87
0.56
6.19
30.77
0.81
0.02
0.00
0.01
0.01
0.48
0.00
0.01
6.95
29. August 2013
1528.95 mg
Sum
[%]
0.81
Average
Mass
[ppm]
8065
525
158
52.51
0.87
524353
8746
5629
61923
37.52
0.81
307737
8056
176
0.02
1
127
101
0.50
4846
21
70
6.96
69466
69557
1000000
5074
176
375289
8056
525037
8746
Sum
[ppm]
8065
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com