Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BFP 840ESD H6327
MA000976108
PG-SOT343-4-2
Material Group
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
tin
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.003
0.001
0.024
0.001
0.003
0.010
3.433
0.010
0.030
0.651
2.347
0.199
0.216
Average
Mass
[%]
0.04
0.01
0.34
0.01
0.05
0.15
49.54
0.15
0.44
9.40
33.87
2.88
3.12
27. February 2015
6.93 mg
Sum
[%]
Average
Mass
[ppm]
393
101
0.39
3430
100
498
1493
49.75
0.15
495500
1468
4370
93965
43.71
2.88
3.12
338713
28755
31214
437048
28755
31214
1000000
497591
1468
3924
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
京公网安备 11010802033920号
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