Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB100N04S2L-03
MA000275877
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
12.294
0.304
0.091
304.026
7.694
10.110
111.212
552.690
9.657
0.228
0.001
0.192
0.154
7.350
0.165
0.548
547.666
Average
Mass
[%]
0.79
0.02
0.01
19.43
0.49
0.65
7.11
35.32
0.62
0.01
0.00
0.01
0.01
0.47
0.01
0.04
35.01
29. August 2013
1564.38 mg
Sum
[%]
0.79
Average
Mass
[ppm]
7858
195
58
19.46
0.49
194343
4918
6463
71090
43.08
0.62
353294
6173
146
0.01
1
123
98
0.49
4699
105
351
35.06
350085
350541
1000000
4920
146
430848
6173
194596
4918
Sum
[ppm]
7858
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com