Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD30N03S2L-07
MA000254533
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
4.029
0.215
0.065
215.017
0.660
1.252
21.909
102.036
3.740
0.091
0.000
0.080
0.064
3.055
0.019
0.006
19.177
Average
Mass
[%]
1.08
0.06
0.02
57.89
0.18
0.34
5.90
27.47
1.01
0.02
0.00
0.02
0.02
0.82
0.01
0.00
5.16
29. August 2013
371.41 mg
Sum
[%]
1.08
Average
Mass
[ppm]
10847
580
174
57.97
0.18
578913
1778
3371
58989
33.71
1.01
274721
10070
244
0.02
1
215
172
0.86
8224
52
16
5.17
51633
51701
1000000
8611
245
337081
10070
579667
1778
Sum
[ppm]
10847
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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