Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB47N10SL-26
MA000532856
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
7.916
0.304
0.091
304.026
3.321
10.229
112.516
559.172
9.657
0.228
0.001
0.137
0.109
5.219
0.165
0.548
547.666
Average
Mass
[%]
0.51
0.02
0.01
19.47
0.21
0.66
7.21
35.80
0.62
0.01
0.00
0.01
0.01
0.33
0.01
0.04
35.08
29. August 2013
1561.30 mg
Sum
[%]
0.51
Average
Mass
[ppm]
5070
195
58
19.50
0.21
194726
2127
6551
72066
43.67
0.62
358143
6185
146
0.01
1
88
70
0.35
3343
105
351
35.13
350775
351231
1000000
3501
146
436761
6185
194979
2127
Sum
[ppm]
5070
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com