Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPB80N06S-08
MA000532034
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
13.370
0.853
0.256
851.691
4.801
8.695
95.644
475.321
9.657
0.228
0.001
0.202
0.162
7.733
Average
Mass
[%]
0.91
0.06
0.02
57.98
0.33
0.59
6.51
32.37
0.66
0.02
0.00
0.01
0.01
0.53
29. August 2013
1468.61 mg
Sum
[%]
0.91
Average
Mass
[ppm]
9104
581
174
58.06
0.33
579930
3269
5920
65125
39.47
0.66
323653
6575
156
0.02
0
138
110
0.55
5265
5513
1000000
156
394698
6575
580685
3269
Sum
[ppm]
9104
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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