Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD90N06S4L-03
MA000472036
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
5.184
0.140
0.042
139.706
2.243
1.432
25.066
116.738
3.740
0.091
0.000
0.099
0.079
3.796
0.028
0.095
94.488
Average
Mass
[%]
1.32
0.04
0.01
35.55
0.57
0.36
6.38
29.71
0.95
0.02
0.00
0.03
0.02
0.97
0.01
0.02
24.04
29. August 2013
392.97 mg
Sum
[%]
1.32
Average
Mass
[ppm]
13192
356
107
35.60
0.57
355514
5708
3645
63787
36.45
0.95
297067
9517
231
0.02
1
253
202
1.02
9659
72
241
24.07
240448
240761
1000000
10114
232
364499
9517
355977
5708
Sum
[ppm]
13192
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com