Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD50N04S3-09
MA000461960
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.791
0.140
0.042
139.706
1.991
1.466
25.659
119.499
3.740
0.091
0.000
0.049
0.039
1.863
0.028
0.095
94.488
Average
Mass
[%]
0.46
0.04
0.01
35.74
0.51
0.38
6.57
30.59
0.96
0.02
0.00
0.01
0.01
0.48
0.01
0.02
24.19
29. August 2013
390.69 mg
Sum
[%]
0.46
Average
Mass
[ppm]
4585
358
107
35.79
0.51
357590
5097
3753
65677
37.54
0.96
305867
9573
232
0.02
1
125
100
0.50
4769
73
242
24.22
241851
242166
1000000
4994
233
375297
9573
358055
5097
Sum
[ppm]
4585
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com