Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB80N04S3-04
MA000366353
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
4.719
0.853
0.256
851.691
5.867
8.800
96.796
481.045
9.657
0.228
0.001
0.093
0.075
3.558
Average
Mass
[%]
0.32
0.06
0.02
58.18
0.40
0.60
6.61
32.87
0.66
0.02
0.00
0.01
0.01
0.24
29. August 2013
1463.64 mg
Sum
[%]
0.32
Average
Mass
[ppm]
3224
583
175
58.26
0.40
581901
4009
6012
66133
40.08
0.66
328663
6598
156
0.02
0
64
51
0.26
2431
2546
1000000
156
400808
6598
582659
4009
Sum
[ppm]
3224
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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