IC SPEAKER PHONE CIRCUIT, PDSO24, PLASTIC, SOT-137, SO-24, Telephone Circuit
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP24,.4 |
针数 | 24 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 15.4 mm |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 75 °C |
最低工作温度 | -25 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP24,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 2.9/12 V |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大压摆率 | 3.8 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
电信集成电路类型 | SPEAKER PHONE CIRCUIT |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.5 mm |
TEA1095T | TEA1095TS-T | TEA1095T-T | TEA1095 | TEA1095TS | |
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描述 | IC SPEAKER PHONE CIRCUIT, PDSO24, PLASTIC, SOT-137, SO-24, Telephone Circuit | IC SPEAKER PHONE CIRCUIT, PDSO24, PLASTIC, SSOP-24, Telephone Circuit | IC SPEAKER PHONE CIRCUIT, PDSO24, PLASTIC, SOT-137, SO-24, Telephone Circuit | IC SPEAKER PHONE CIRCUIT, PDIP24, 0.600 INCH, PLASTIC, SOT-101, DIP-24, Telephone Circuit | IC SPEAKER PHONE CIRCUIT, PDSO24, PLASTIC, SSOP-24, Telephone Circuit |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | SSOP | SOIC | DIP | SSOP |
包装说明 | SOP, SOP24,.4 | SSOP, | SOP, | DIP, DIP24,.6 | SSOP, SSOP24,.3 |
针数 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 |
长度 | 15.4 mm | 8.2 mm | 15.4 mm | 31.7 mm | 8.2 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SSOP | SOP | DIP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 2 mm | 2.65 mm | 5.1 mm | 2 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
电信集成电路类型 | SPEAKER PHONE CIRCUIT | SPEAKER PHONE CIRCUIT | SPEAKER PHONE CIRCUIT | SPEAKER PHONE CIRCUIT | SPEAKER PHONE CIRCUIT |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.5 mm | 5.3 mm | 7.5 mm | 15.24 mm | 5.3 mm |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 |
JESD-609代码 | e4 | e4 | e4 | - | e4 |
封装等效代码 | SOP24,.4 | - | - | DIP24,.6 | SSOP24,.3 |
电源 | 2.9/12 V | - | - | 2.9/12 V | 2.9/12 V |
最大压摆率 | 3.8 mA | - | 3.8 mA | 0.0038 mA | 0.0038 mA |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD |
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