Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI60R190C6
MA001135256
PG-TO262-3-22
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
antimony
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-36-0
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
8.148
0.851
0.255
849.682
2.387
2.309
66.949
507.887
15.198
1.651
1.028
0.411
2.672
0.106
0.032
106.210
Average
Mass
[%]
0.52
0.05
0.02
54.25
0.15
0.15
4.28
32.44
0.97
0.11
0.07
0.03
0.17
0.01
0.00
6.78
29. August 2013
1565.78 mg
Sum
[%]
0.52
Average
Mass
[ppm]
5204
543
163
54.32
0.15
542659
1525
1474
42758
36.87
0.97
0.11
324368
9706
1054
656
263
0.27
1707
68
20
6.79
67832
67920
1000000
2626
368600
9706
1054
543365
1525
Sum
[ppm]
5204
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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