Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ITD50N04S4L-07
MA001116614
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
2.029
0.205
0.061
204.243
4.229
1.380
24.151
112.475
5.072
0.076
0.000
0.050
0.040
1.894
Average
Mass
[%]
0.57
0.06
0.02
57.38
1.19
0.39
6.79
31.60
1.43
0.02
0.00
0.01
0.01
0.53
29. August 2013
355.91 mg
Sum
[%]
0.57
Average
Mass
[ppm]
5701
575
172
57.46
1.19
573868
11883
3878
67858
38.78
1.43
316026
14252
214
0.02
1
139
111
0.55
5322
5572
1000000
215
387762
14252
574615
11883
Sum
[ppm]
5701
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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