Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPU60R950C6
MA000986850
PG-TO251-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
plastics
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
antimonytrioxide
brominated resin
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1309-64-4
-
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
2.144
0.229
0.069
228.946
0.432
1.736
1.860
1.984
16.741
101.687
3.740
0.509
0.056
0.045
2.144
0.019
0.006
19.177
Average
Mass
[%]
0.56
0.06
0.02
60.02
0.11
0.46
0.49
0.52
4.39
26.65
0.98
0.13
0.01
0.01
0.56
0.00
0.00
5.03
8. October 2014
381.53 mg
Sum
[%]
0.56
Average
Mass
[ppm]
5619
601
180
60.10
0.11
600083
1132
4550
4875
5201
43879
32.51
0.98
0.13
266527
9803
1334
147
118
0.58
5621
50
15
5.03
50265
50330
1000000
5886
325032
9803
1334
600864
1132
Sum
[ppm]
5619
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com