Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC0901NSI
MA001025842
PG-TDSON-8-6
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.629
0.038
0.011
37.762
0.045
0.088
6.215
37.464
1.470
0.166
0.023
0.019
0.895
0.011
0.003
11.320
0.022
0.007
22.292
Average
Mass
[%]
0.53
0.03
0.01
31.87
0.04
0.07
5.25
31.62
1.24
0.14
0.02
0.02
0.76
0.01
0.00
9.55
0.02
0.01
18.81
14. August 2015
118.48 mg
Sum
[%]
0.53
Average
Mass
[ppm]
5310
319
96
31.91
0.04
318720
380
739
52455
36.94
1.24
0.14
316209
12406
1397
198
158
0.80
7550
96
29
9.56
95545
188
57
18.84
188148
188393
1000000
95670
7906
369403
12406
1397
319135
380
Sum
[ppm]
5310
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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