Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ0902NSI
MA001013832
PG-TSDSON-8-26
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.393
0.002
0.010
0.197
7.988
0.030
0.037
1.924
16.721
0.400
0.020
0.016
0.012
0.592
0.001
0.005
0.094
3.816
0.001
0.005
0.101
4.112
Average
Mass
[%]
1.08
0.01
0.03
0.54
21.90
0.08
0.10
5.28
45.84
1.10
0.06
0.04
0.03
1.62
0.00
0.01
0.26
10.46
0.00
0.01
0.28
11.27
14. August 2015
36.48 mg
Sum
[%]
1.08
Average
Mass
[ppm]
10761
67
270
5393
22.48
0.08
218990
810
1024
52751
51.22
1.10
0.06
458371
10971
557
425
340
1.69
16239
32
129
2576
10.73
104608
35
139
2776
11.56
112736
115686
1000000
107345
17004
512146
10971
557
224720
810
Sum
[ppm]
10761
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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京公网安备 11010802033920号
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