Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-TC1766-192F80HL BD
MA000928068
PG-LQFP-176-14
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
36.463
0.746
3.234
14.926
478.622
3.526
4.452
136.527
1343.008
15.333
2.988
1.393
4.178
Average
Mass
[%]
1.78
0.04
0.16
0.73
23.40
0.17
0.22
6.67
65.66
0.75
0.15
0.07
0.20
20. November 2015
2045.40 mg
Sum
[%]
1.78
Average
Mass
[ppm]
17827
365
1581
7297
24.33
0.17
234000
1724
2177
66748
72.55
0.75
0.15
656601
7496
1461
681
0.27
2042
2723
1000000
725526
7496
1461
243243
1724
Sum
[ppm]
17827
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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