Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
TDA5220
MA000226486
PG-TSSOP-28-1
Material Group
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.457
14.398
19.882
0.938
0.196
8.301
56.867
1.559
1.416
0.196
0.786
Average
Mass
[%]
2.30
13.46
18.58
0.88
0.18
7.76
53.15
1.46
1.32
0.18
0.73
7. September 2015
107.00 mg
Sum
[%]
2.30
Average
Mass
[ppm]
22966
134561
32.04
0.88
185822
8768
1833
77585
61.09
1.46
1.32
531486
14568
13231
1836
0.91
7344
9180
1000000
610904
14568
13231
320383
8768
Sum
[ppm]
22966
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
