Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4295G V33
MA000050177
PG-SCT595-5-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.315
0.001
0.006
0.018
6.019
0.030
0.055
0.069
0.137
1.248
5.350
0.340
0.142
0.030
0.142
Average
Mass
[%]
2.26
0.01
0.04
0.13
43.31
0.22
0.39
0.49
0.99
8.98
38.48
2.44
1.02
0.22
1.02
24. November 2015
13.90 mg
Sum
[%]
2.26
Average
Mass
[ppm]
22626
87
435
1304
43.49
0.22
432962
2185
3947
4934
9868
89796
49.33
2.44
1.02
384842
24430
10179
2171
1.24
10234
12405
1000000
493387
24430
10179
434788
2185
Sum
[ppm]
22626
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
NXP MCU
京公网安备 11010802033920号
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