Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC4500-F100K1024 AC
MA001332122
PG-LQFP-100-25
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
magnesium
silicon
nickel
copper
gold
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
36.527
0.228
0.988
4.559
146.196
0.002
0.038
1.676
1.392
54.278
408.247
7.134
1.213
1.735
6.150
Average
Mass
[%]
5.45
0.03
0.15
0.68
21.81
0.00
0.01
0.25
0.21
8.10
60.89
1.06
0.18
0.26
0.92
20. November 2015
670.36 mg
Sum
[%]
5.45
Average
Mass
[ppm]
54488
340
1474
6801
22.67
218085
3
56
0.26
2500
2076
80969
69.20
1.06
0.18
608994
10642
1809
2588
1.18
9175
11763
1000000
692039
10642
1809
2559
226700
Sum
[ppm]
54488
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com