Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BGS 110MN20 E6327
MA001271020
PG-TSNP-20-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
inorganic material
plastics
plastics
< 10%
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silicondioxide
acrylic resin
polyester resin
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
60676-86-0
-
-
Issued
Weight*
Weight
[mg]
0.599
0.005
0.023
0.108
3.460
0.121
0.030
0.873
5.115
0.199
0.090
0.084
0.084
0.084
0.084
Average
Mass
[%]
5.47
0.05
0.21
0.98
31.58
1.11
0.27
7.96
46.69
1.82
0.82
0.76
0.76
0.76
0.76
4. September 2015
10.96 mg
Sum
[%]
5.47
Average
Mass
[ppm]
54665
492
2134
9847
32.82
1.11
315756
11074
2746
79625
54.92
1.82
0.82
466770
18198
8193
7625
7625
7625
3.04
7625
30500
1000000
549141
18198
8193
328229
11074
Sum
[ppm]
54665
wire
encapsulation
leadfinish
plating
tape
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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