Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
leadfinish
plating
glue
solder
BSB280N15NZ3 G
MA001355930
MG-WDSON-2-9
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
plastics
noble metal
non noble metal
noble metal
non noble metal
plastics
< 10%
Substances
silicon
copper
nickel
silver
nickel
epoxy resin
silver
copper
silver
tin
epoxy resin
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
7440-22-4
7440-02-0
-
7440-22-4
7440-50-8
7440-22-4
7440-31-5
-
Issued
Weight*
Weight
[mg]
4.059
74.415
0.211
0.840
0.211
0.184
1.130
0.011
0.066
2.119
0.327
Average
Mass
[%]
4.86
89.04
0.25
1.01
0.25
0.22
1.35
0.01
0.08
2.54
0.39
4. September 2015
83.57 mg
Sum
[%]
4.86
89.04
Average
Mass
[ppm]
48567
890422
2527
1.26
0.25
10051
2527
2201
1.57
13519
131
788
2.63
0.39
25350
3917
26269
3917
1000000
15720
12578
2527
Sum
[ppm]
48567
890422
passivation
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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