Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPU60R950C6
MA001348754
PG-TO251-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
2.144
0.229
0.069
228.946
0.419
0.391
11.871
118.184
3.787
0.515
0.056
0.045
2.144
Average
Mass
[%]
0.58
0.06
0.02
62.07
0.11
0.11
3.22
32.05
1.03
0.14
0.02
0.01
0.58
28. September 2015
368.80 mg
Sum
[%]
0.58
Average
Mass
[ppm]
5813
622
186
62.15
0.11
620787
1136
1061
32187
35.38
1.03
0.14
320455
10268
1397
152
122
0.61
5814
6088
1000000
353703
10268
1397
621595
1136
Sum
[ppm]
5813
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
无线连接
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