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IDT74LVC162827APV8

产品描述Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56
产品类别逻辑    逻辑   
文件大小66KB,共6页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT74LVC162827APV8概述

Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56

IDT74LVC162827APV8规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
零件包装代码SSOP
包装说明SSOP,
针数56
Reach Compliance Codeunknown
其他特性WITH DUAL OUTPUT ENABLE
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G56
JESD-609代码e0
长度18.415 mm
逻辑集成电路类型BUS DRIVER
位数10
功能数量2
端口数量2
端子数量56
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
传播延迟(tpd)8 ns
认证状态Not Qualified
座面最大高度2.794 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.635 mm
端子位置DUAL
宽度7.5 mm

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IDT74LVC162827A
3.3V CMOS 20-BIT BUFFER WITH 5 VOLT TOLERANT I/O
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS
20-BIT BUFFER
WITH 5 VOLT TOLERANT I/O
FEATURES:
DESCRIPTION:
IDT74LVC162827A
• Typical t
SK(o)
(Output Skew) < 250ps
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• CMOS power levels (0.4µ W typ. static)
µ
• All inputs, outputs, and I/O are 5V tolerant
• Supports hot insertion
• Available in SSOP, TSSOP, and TVSOP packages
DRIVE FEATURES:
APPLICATIONS:
• High Output Drivers: ±12mA
• Reduced system switching noise
• 5V and 3.3V mixed voltage systems
• Data communication and telecommunication systems
The LVC162827A 20-bit buffer is built using advanced dual metal CMOS
technology. The 20-bit bus driver provides high-performance bus interface
buffering for wide data/address paths or busses carrying parity. Two pair
of NAND-ed output enable controls offer maximum control flexibility and are
organized to operate the device as two 10-bit buffers or one 20-bit buffer.
Flow-through organization of signal pins simplifies layout. All inputs are
designed with hysteresis for improved noise margin.
The LVC162827A buffer is ideally suited for driving high capacitance
loads and low impedance backplanes. The output buffers are designed with
power off disable capability to allow “live insertion” of boards when used as
backplane drivers.
All pins can be driven from either 3.3V or 5V devices. This feature allows
the use of this device as a translator in a mixed 3.3V/5V supply system.
The LVC162827A has been designed with a
±
12mA output driver. This
driver is capable of driving a moderate to heavy load while maintaining
speed performance.
FUNCTIONAL BLOCK DIAGRAM
1
OE
1
1
OE
2
1
56
2
OE
1
2
OE
2
28
29
1
A
1
55
2
1
Y
1
2
A
1
42
15
2
Y
1
TO NINE OTHER CHANNELS
TO NINE OTHER CHANNELS
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
© 1999 Integrated Device Technology, Inc.
OCTOBER 1999
DSC-4947/1

IDT74LVC162827APV8相似产品对比

IDT74LVC162827APV8 IDT74LVC162827APA8 IDT74LVC162827APF8
描述 Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56 Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56, 0.50 MM PITCH, TSSOP-56 Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SSOP TSSOP SSOP
包装说明 SSOP, TSSOP, TSSOP,
针数 56 56 56
Reach Compliance Code unknown unknown unknown
其他特性 WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56
JESD-609代码 e0 e0 e0
长度 18.415 mm 14 mm 11.3 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER
位数 10 10 10
功能数量 2 2 2
端口数量 2 2 2
端子数量 56 56 56
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd) 8 ns 8 ns 8 ns
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 2.794 mm 1.1 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING
端子节距 0.635 mm 0.5 mm 0.4 mm
端子位置 DUAL DUAL DUAL
宽度 7.5 mm 6.1 mm 4.4 mm

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