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MADP000015-000030-30

产品描述SILICON, PIN DIODE, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE 30, 2 PIN
产品类别分立半导体    二极管   
文件大小365KB,共7页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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MADP000015-000030-30概述

SILICON, PIN DIODE, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE 30, 2 PIN

MADP000015-000030-30规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
包装说明O-CEMW-N2
针数2
制造商包装代码CASE 30
Reach Compliance Codeunknown
其他特性HIGH RELIABILITY
应用SWITCHING
配置SINGLE
二极管元件材料SILICON
二极管类型PIN DIODE
JESD-30 代码O-CEMW-N2
元件数量1
端子数量2
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状ROUND
封装形式MICROWAVE
认证状态Not Qualified
表面贴装YES
技术POSITIVE-INTRINSIC-NEGATIVE
端子形式NO LEAD
端子位置END

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Packaged PIN Diodes
RoHS Compliant
Features
High Power
Fast Speed
Voltage Ratings to 1500 Volts
Wide Selection of Carrier Lifetimes
Wide Selection of Capacitances
Assortment of Packages Styles
Available Screened for Military Applications
Rev V.6
Maximum Power Dissipation
P
diss
=
30,31,32,36,43,94,111,120,150,255 T (max Operating)-25°C
Thermal Resistance
258,296,1072,1079
Leaded Packages
@+25°C
186, 276,1088
Surface Mount Package
+25°C
1056
P
diss
= 250mW
Cathode Heatsink Packages
Description and Applications
M/A-COM's broad line of packaged PIN diodes
encompasses a comprehensive range of electrical
characteristics and package outlines. This diverse union
of semiconductor technology and chip packaging gives
considerable flexibility to the circuit designer. The fast
switching series of packaged PIN diodes utilize a thin
I-region and silicon oxide or glass passivated chips
which provide for low leakage currents and low insertion
loss. Using in process control monitors to regulate wafer
fabrication parameters these devices achieve consistent
performance in control circuit applications. The high
voltage product line of packaged PIN diodes employs
M/A-COM's unique CERMACHIP
®
passivation
process
which provides for a hard glass encapsulation that
hermetically seals the active area of the chip. These
®
packaged CERMACHIP PIN diodes are ideally suited
for use in high power applications where high RF
voltages are present. The diode chips are bonded into
sealed ceramic packages that are designed for the most
stringent electrical and environmental conditions. A wide
choice of packages are available which can be mounted
into a variety of microwave and RF circuit media. The
Packaged PIN Diodes series are designed to have a
high inherent reliability and may be ordered screened to
meet many MIL-STD reliability levels.
P
diss
= 300mW
Co-Axial Packages
31,32,94
36
30, 296
120,255
Surface Mount Packages
276
1088
1056
186
1072,1079
Threaded Packages
Absolute Maximum Ratings
1
Parameter
Voltage
Operating Temperature
Storage Temperature
Operating and Storage
(Case Style 1088)
Absolution Max.
As Specified in Table
- 65°C to +175°C
- 65°C to +200°C
- 65°C to +125°C
150
111
43
258
Unpackaged Die
1. Operation beyond any one of the above conditions may
cause permanent damage to the device.
Specifications subject to change without prior notification.
131,132.134 , 212
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)) or
volume is not guaranteed.
information contained herein without notice.
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