NCV7708E
Double Hex Driver
The NCV7708E is a fully protected Hex−Half Bridge−Driver
designed specifically for automotive and industrial motion control
applications. The six low and high side drivers are freely configurable
and can be controlled separately. This allows for high side, low side,
and H−Bridge control. H−Bridge control provides forward, reverse,
brake, and high impedance states. The drivers are controlled via a
standard SPI interface.
Features
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Ultra Low Quiescent Current Sleep Mode
Six Independent High−Side and Six independent Low−Side Drivers
Integrated Freewheeling Protection (LS and HS)
Internal Upper and Lower Clamp Diodes
Configurable as H−Bridge Drivers
0.5 A Continuous (1 A peak) Current
R
DS(on)
= 0.8
W
(typ)
5 MHz SPI Control
SPI Valid Frame Detection
Compliance with 5 V and 3.3 V Systems
Overvoltage Lockout
Undervoltage Lockout
Fault Reporting
Current Limit
Overtemperature Protection
Internally Fused Lead in SOIC−28
Packaged for Better Thermal Performance
•
These are Pb−Free Devices*
Typical Applications
SOIC−28
DW SUFFIX
CASE 751F
MARKING DIAGRAM
NCV7708E
AWLYYWWG
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
1
OUTL5
OUTH5
OUTH4
OUTL4
VS2
GND
GND
GND
GND
VS1
OUTL3
OUTH3
OUTH2
OUTL2
OUTH6
OUTL6
SI
SCLK
CSB
GND
GND
GND
GND
V
CC
SO
EN
OUTL1
OUTH1
•
Automotive
•
Industrial
•
DC Motor Management
ORDERING INFORMATION
Device
NCV7708EDWR2G
Package
SOIC−28W
(Pb−Free)
Shipping
†
1000/
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 1
Publication Order Number:
NCV7708E/D
NCV7708E
VS1
DRIVE 1
High−Side
Driver
Waveshaping
VS
EN
ENABLE
CP
Charge
Pump
Control
Logic
BIAS
POR
Fault
Detect
SPI
Control
SO
Fault
VS
OUTH1
V
CC
Low−Side
Driver
Waveshaping
Under−load
Overcurrent
Thermal
Warning/Shutdown
OUTL1
SI
SPI
SCLK
16 Bit
Logic
and
Latch
VS
OUTH2
DRIVE 2
CSB
CP
OUTL2
VS
DRIVE 3
CP
OUTH3
OUTL3
VS1
Undervoltage
Lockout
VS2
CP
VS
DRIVE 4
OUTL4
OUTH4
VS1
Overvoltage
Lockout
VS2
VS
DRIVE 5
CP
OUTH5
OUTL5
VS
DRIVE 6
CP
OUTH6
OUTL6
GND
VS2
Figure 1. Block Diagram
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NCV7708E
PIN DESCRIPTION
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Symbol
OUTL5
OUTH5
OUTH4
OUTL4
VS2
GND
GND
GND
GND
VS1
OUTL3
OUTH3
OUTH2
OUTL2
OUTH1
OUTL1
EN
SO
V
CC
GND
GND
GND
GND
CSB
SCLK
SI
OUTL6
OUTH6
Description
Output Low Side 5. Open drain output driver with internal reverse diode.
Output High Side 5. Open source output driver with internal reverse diode. Drain connected to VS2.
Output High Side 4. Open source output driver with internal reverse diode. Drain connected to VS2.
Output Low Side 4. Open drain output driver with internal reverse diode.
Voltage Power Supply input for the High−Side Output Drivers 4, 5, and 6.
Ground
Ground
Ground
Ground
Voltage Power Supply input for the High−Side Output Drivers 1, 2, and 3, All six low side pre−drivers,
and all six charge pumps.
Output Low Side 3. Open drain output driver with internal reverse diode.
Output High Side 3. Open source output driver with internal reverse diode. Drain connected to VS1.
Output High Side 2. Open source output driver with internal reverse diode. Drain connected to VS1.
Output Low Side 2. Open drain output driver with internal reverse diode.
Output High Side 1. Open source output driver with internal reverse diode. Drain connected to VS1.
Output Low Side 1. Open drain output driver with internal reverse diode.
Enable. Input high wakes the IC up from a sleep mode.
Serial Output. 16 bit serial communications output.
Power supply input for Logic.
Ground
Ground
Ground
Ground
Chip Select Bar. Active low serial port operation.
Serial Clock. Clock input for use with SPI communication.
Serial Input. 16 bit serial communications input.
Output Low Side 6. Open drain output driver with internal reverse diode.
Output High Side 6. Open source output driver with internal reverse diode. Drain connected to VS2.
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3
NCV7708E
MAXIMUM RATINGS
Rating
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500 ms, Ivsx > −2 A
Output Pin OUTHx
(DC)
(AC – inductive clamping)
Output Pin OUTLx
(DC)
(AC), t < 500 ms, IOUTLx > −2 A
(AC Inductive Clamping)
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, V
CC
)
Output Current (OUTL1, OUTL2, OUTL3, OUTL4, OUTL5, OUTL6, OUTH1, OUTH2, OUTH3, OUTH4,
OUTH5, OUTH6)
(DC) Vds = 12 V
(DC) Vds = 20 V
(DC) Vds = 40 V
(AC) Vds = 12 V, (50 ms pulse, 1 s period)
(AC) Vds = 20 V, (50 ms pulse, 1 s period)
(AC) Vds = 40 V, (50 ms pulse, 1 s period)
Electrostatic Discharge, Human Body Model, VS1, VS2, OUTx
Electrostatic Discharge, Human Body Model, all other pins
Electrostatic Discharge, Machine Model
Electrostatic Discharge, Charged Device Model
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C (Note 1)
Value
Unit
V
−0.3 to 40
−1.0
V
−0.3 to 40
−8.0
V
−0.3 to 34
−1.0
48
−0.3 to 7.0
V
A
−1.5 to 1.5
−0.7 to 0.7
−0.25 to 0.25
−2.0 to 2.0
−0.9 to 0.9
−0.3 to 0.3
4.0
2.0
200
1.0
−40 to 150
−55 to 150
MSL 3
260
kV
kV
V
kV
°C
°C
−
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.
RECOMMENDED OPERATING CONDITIONS
Value
Rating
Digital Supply Input Voltage (V
CC
)
Battery Supply Input Voltage (V
S
)
DC Output Current (D
x
, S
x
)
Junction Temperature (T
J
)
Min
3.0
5.1
−
−40
Max
5.5
28
0.5
125
Unit
V
V
A
°C
THERMAL CONDITIONS
Test Conditions, Typical Value
Thermal Parameters
Junction−to−Lead (psi−JL8,
Y
JL8
) or Pins 6−9, 20−23
Junction−to−Ambient (R
qJA
,
q
JA
)
Board Details (Note 2)
10
73
Board Details (Note 3)
11
56
Unit
°C/W
°C/W
2. 1−oz copper, 240 mm
2
copper area, 0.062″ thick FR4. This is the minimum pad board size.
3. 1−oz copper, 986 mm
2
copper area, 0.062″ thick FR4.
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4
NCV7708E
ELECTRICAL CHARACTERISTICS
(−40°C < T
J
< 150°C, 5.5 V < VSx < 40 V, 3 V < V
CC
< 5.25 V, EN = V
CC
, unless otherwise specified)
Characteristic
GENERAL
Supply Current (VS1 + VS2)
Sleep Mode (Note 4)
Supply Current (VS1)
Active Mode
Supply Current (V
CC
) − Sleep Mode (Note 4)
VS1 = VS2 = 13.2 V, V
CC
= CSB = 5 V,
EN = SI = SCLK = 0 V (−40°C to 85°C)
EN = V
CC
, 5.5 V < VSx < 35 V
No Load
CSB = V
CC
, EN = SI = SCLK = 0 V
(−40°C to 85°C)
EN = CSB = V
CC
, SI = SCLK = 0 V
EN = V
CC
, 5.5 V < VSx < 35 V
No Load
−
1.0
5.0
mA
Test Conditions
Min
Typ
Max
Unit
−
−
2.0
1.0
4.0
2.5
mA
mA
Supply Current (V
CC
) − Active Mode
Supply Current (VS2)
Active Mode
V
CC
Power−On−Reset Threshold
VSx Undervoltage Detection Threshold
VSx Undervoltage Detection Hysteresis
VSx Overvoltage Detection Threshold
VSx Overvoltage Detection Hysteresis
Thermal Warning (Note 5)
Thermal Warning Hysteresis (Note 5)
Thermal Shutdown (Note 5)
−
−
2.60
1.5
0.5
2.80
4.6
−
37.5
3.5
145
30
175
1.20
3.0
1.0
3.00
5.1
400
40.0
5.5
170
−
195
−
mA
mA
V
V
mV
V
V
°C
°C
°C
−
VSx decreasing
4.2
100
VSx increasing
35.0
1.5
120
−
155
1.05
Ratio of Thermal Shutdown to Thermal Warning (Note 5)
OUTPUTS
Output High R
DSon
(source)
I
out
= −500 mA
8 V < Vs < 40 V
8 V < Vs < 40 V, T = 25°C
5.5 V < Vs
≤
8 V
5.5 V < Vs
≤
8 V, T = 25°C
I
out
= 500 mA
8 V < Vs < 40 V
8 V < Vs < 40 V, T = 25°C
5.5 V < Vs
≤
8 V
5.5 V < Vs
≤
8 V, T = 25°C
OUTH(1−6) = 0 V, VSx = 40 V, V
CC
= 5 V
OUTH(1−6) = 0 V, Vsx = 13.2 V, V
CC
= 5V
OUTL(1−6) = 34 V, V
CC
= 5 V, T = 125°C
OUTL(1−6) = 34 V, V
CC
= 5 V, T = 25°C
V
CC
= 5 V, Vsx = 13.2 V
V
CC
= 5 V, Vsx = 13.2 V
V
CC
= 5 V, Vsx = 13.2 V
V
CC
= 5 V, Vsx = 13.2 V
W
−
−
−
−
−
0.8
−
1.3
1.8
1.0
2.2
−
W
−
−
−
−
−5.0
−1.0
−
−
−1.9
−5.0
1.0
10
10
−
0.8
−
1.3
−
−
−
−
−1.45
−3.0
1.45
25
25
1.8
1.0
2.2
−
−
−
5.0
1.0
−1.0
−2.0
1.9
50
50
mA
mA
Output Low R
DSon
(sink)
Source Leakage Current
Sink Leakage Current
Overcurrent Shutdown Threshold (OUTHx)
Current Limit (OUTHx)
Overcurrent Shutdown Threshold (OUTLx)
Overcurrent Shutdown Delay Time − Source
Overcurrent Shutdown Delay Time
− Sink
4.
5.
6.
7.
A
A
A
ms
For temperatures above 85°C, refer to graphs for VSx and V
CC
Sleep Current vs. Temperature on page 13.
Thermal characteristics are not subject to production test.
Refer to “Typical High−Side Negative Clamp Voltage” graph on page 13.
Not production tested.
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